Data / Files
1. Data Provision
To ensure a fast and error-free production process, we require detailed manufacturing data along with your PCB layout. These data files form the foundation for efficient project setup and accurate assembly.
In addition to standard Gerber and drill files, we can also process project data directly from common CAD design tools such as: Eagle (*.sch / *.brd), Protel (*.ddb), Altium Designer (*.pcbdoc), Target3001 (*.T3001), or ODB++. Our system supports most industry-standard formats for seamlessly data transfer.

If you do not have complete board data, please provide at least the following:

  • Assembly drawing or plan (PDF or derived from Gerber data)
  • Bill of Materials (BOM)
  • Pick & Place file (component coordinates)
  • Gerber data for stencil production (if applicable)
2. Bill of Materials (BOM)
A complete and clearly structured BOM accelerates both quotation and production stages. The more detailed the component descriptions, the lower the risk of technical errors and clarification delays.
Your BOM should preferably be in Excel format (.xlsx) or another easily convertible file type and include the following essential information:
  • Position number
  • Reference designator (e.g. R1, C1, D1, IC1, etc.)
  • Component type and value
  • Package (e.g. 0603, 1206, SOT-223, etc.)
  • Is assembled (Yes/No)
  • Quantity per item
  • Provided by customer (Yes/No)
  • Assembly notes or remarks
  • Distributor and part number
Pos. Part Description Value Place Manufacturer PartName Quantity Provided by Link
1. C1, C2 POLARIZED CAPACITOR 470uF No, Yes - CPOL-EUE5-8.5 1 ProfiAnts www. ..
2. D1, D2 Z DIODE BZV55C10SMD Yes, Yes - BZV55C10 SMD 2 ProfiAnts www. ..
3. Q1, Q2, Q3 PNP SOT223 transistor 1,0A,60V BZV55C10SMD Yes, Yes, No - BCP55-16 SMD 2 by customer www. ..
4. R1, R2, R3, R4 Resistor 47k BZV55C10SMD Yes, Yes, No, Yes - R-EU_M0805 3 ProfiAnts www. ..
5. X1, X2, X3 PHOENIX miniature 2,54 - Yes, Yes, No PHOENIX CONTACT MPT 0,5/ 2-2,54 2 ProfiAnts www. ..
Number of components to be assembled: 10
Please remove non-electrical items (screws, washers, spacers, labels, test points, etc.) if they are not to be assembled.
3. Pick & Place File
The Pick & Place file contains the X/Y coordinates and rotation of each component and is essential for automated assembly. It must correspond precisely with the BOM and layout.
  • Reference designator / component name
  • Package type
  • Electrical value
  • X and Y position relative to layout origin
  • Rotation angle (°)
  • Assembly side (TOP/BOTTOM)
Example Pick & Place File:
Pos. Part Description Value Place Side X,mm Y,mm Rotate, ⁰
1. C1 POLARIZED CAPACITOR 470uF No TOP 20,32 7,62 270
2. C2 POLARIZED CAPACITOR 470uF Yes TOP 36,83 7,62 270
3. D1 Z DIODE BZV55C10SMD Yes TOP 12,7 8,89 270
4. D2 Z DIODE BZV55C10SMD Yes TOP 12,7 19,05 90
5. Q1 PNP SOT223 transistor 1,0A,60V Yes TOP 19,05 22,86 0
6. Q2 PNP SOT223 transistor 1,0A,60V Yes TOP 25,4 17,78 0
7. Q3 PNP SOT223 transistor 1,0A,60V No TOP 39,37 22,86 0
8. R1 Resistor 47k Yes TOP 39,37 15,24 0
9. R2 Resistor 47k Yes TOP 33,02 22,86 270
10. R3 Resistor 47k No TOP 33,02 15,24 270
11. R4 Resistor 47k Yes TOP 19,05 17,78 270
12. X1 PHOENIX miniature 2,54 Yes TOP 6,35 13,97 90
13. X2 PHOENIX miniature 2,54 Yes TOP 48,26 10,16 270
14. X3 PHOENIX miniature 2,54 No TOP 49,26 21,59 270
4. Assembly Plan
The assembly plan should provide a clear visual reference for component placement and polarity. It serves as a final check before production and should include:
  • Component name and value
  • Polarity and orientation marks
  • Assembly drawing (preferably in PDF)
  • Marked layout zero point in the silkscreen
Layout Zero Point Example
Pay attention: Missing polarity information or unclear rotation details (especially for connectors or sockets) often cause delays and assembly errors.
5. Solder Paste Stencil
We can generate solder stencil data directly from your CAD files or use supplied Gerber layers. Please mark any pads that should not receive solder paste. Accurate stencil data ensures consistent paste volume and reliable solder joints during SMD reflow.